Results on Proton-Irradiated 3D Pixel Sensors Interconnected to RD53A Readout ASIC

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK (Italy) and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about $1$ $\times$ $10^{16}$ $\text{n}_{\text{eq}}$ cm$^{-2}$ (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.Comment: Conference Proceedings of VCI2019, 15th Vienna Conference of Instrumentation, February 18-22, 2019, Vienna, Austria. arXiv admin note: text overlap with arXiv:1903.0196

Test beam characterization of irradiated 3D pixel sensors

Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance, comply with these extreme conditions. A full study and characterization of pixelated 3D sensors fabricated by FBK is presented here. The sensors were bump-bonded to RD53A readout chips and measured at several CERN SPS test beams. Results on charge collection and efficiency, for both irradiated and non-irradiated samples, are presented. Two main studies are described: in the first the behaviour of the sensor is qualified as a function of irradiation, while kept under identical conditions; in the second the response is measured under typical operating conditions